Optical die sorting, 90° flip and burn-in transfer
Optical module
Requirement
Optical communication die of 0.25-1 mm for 40G, 100G, 400G, 800G and 1.6T datacom products. The customer needed optical-die, electrical-die and lens sorting, transfer, placement and AOI on one platform.
Solution
- Sorting of optical die, electrical die and lenses from wafer.
- 90° flip sorting of single-ball and multi-ball lenses for a lens maker, reducing downstream work and manual handling.
- Transfer and screening in the wire-bond and burn-in steps: die moved automatically to the specified fixture, linked to MES and picked by test result.
Result
Less manual intervention, higher factory automation, and yield control supported at the WB and burn-in steps.
Machines in this case
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation