MEMS and sensor die bonding with membrane-safe handling
Pick and place fragile MEMS die without touching the membrane, then wedge-bond with Al or Au wire.
The hard part
MEMS die are 0.2-20 mm with thin membranes and coatings. Standard ejection can crack them, and downstream wire bonding faces long loops, high density and fine pitch.
How ENG equipment handles it
- M18 Sense: membrane-protecting pick and eject, dispensing or dipping, ±10 μm @3σ with bottom camera.
- G19 where sensor die need ±3 μm @3σ.
- WB20 / WB20 PRO: Al and Au wedge bonding, 63 × 63 μm pads at 68 μm pitch.
- S17 for sensor die sorting with 0° / 90° / 180° flip.
Machines to evaluate
M18 Sense
Sensor & TO Die Bonder
- XY @3σ (bottom cam / upgrade)
- ±10 μm
- UPH
- 1,000
G19 Series
High-Precision Die Bonder
- XY accuracy @3σ
- ±3 μm
- Angle (Plus / Pro)
- ±0.1°
WB20
Ultrasonic Wedge Wire Bonder
- XY bond accuracy
- ≤±0.2 μm
- Max wires/hr
- 12,000
S17 Series
High-Precision Die Sorter
- UPH (S17)
- ≥7,000
- Best XY @3σ (S17 Pro)
- ±15 μm
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation