AI optical modules
Place optical die within ±3 μm.
ENG die bonders, eutectic bonders and CPO coupling systems for 800G and 1.6T transceiver lines.
- G19 die bond
- ±3 μm @3σ
- EX20 eutectic
- ±1.5 μm @3σ
- C20 coupling
- 50-100 nm
1,500+ ENG machines in production at 200+ customers since 2016.
Pick your line.
800G and 1.6T transceivers, silicon photonics, CPO
G19 SeriesHigh-Precision Die Bonder±3 μm XY accuracy @3σ
EX20High-Precision Eutectic Die Bonder±1.5 μm XY accuracy @3σ
C20Fully Automatic Active Alignment & Coupling System≤±0.3 μm XY accuracy (local)
M18-UVPassive Component Die Bonder with UV Cure±10 μm XY accuracy @3σ
SiC sintering, IGBT and IPM module assembly
M18 AgSiC Pre-Sintering Die Bonder±10 μm XY accuracy @3σ
M18 Power SeriesMulti-Chip Die Bonder for IGBT / IPM6 Bond heads (Max / Neat)
A11Multi-Chip FC Module Integrated Bonder11 Bond heads
M18 RivetCopper Pin / Rivet Placement System≥9,000 UPH
Membrane-safe die bonding and wedge wire bonding
M18 SenseSensor & TO Die Bonder±10 μm XY @3σ (bottom cam / upgrade)
WB20Ultrasonic Wedge Wire Bonder≤±0.2 μm XY bond accuracyTwelve machines, full specs on every page.
G19 Series
High-Precision Die Bonder
- XY accuracy @3σ
- ±3 μm
- Angle (Plus / Pro)
- ±0.1°
EX20
High-Precision Eutectic Die Bonder
- XY accuracy @3σ
- ±1.5 μm
- Heating range
- RT-450 ℃
C20
Fully Automatic Active Alignment & Coupling System
- XY accuracy (local)
- ≤±0.3 μm
- Coupling accuracy
- 50-100 nm
M18-UV
Passive Component Die Bonder with UV Cure
- XY accuracy @3σ
- ±10 μm
- Angle @3σ
- ±0.5°
S17 Series
High-Precision Die Sorter
- UPH (S17)
- ≥7,000
- Best XY @3σ (S17 Pro)
- ±15 μm
A19 FC
Flip Chip Bonder
- XYθ global @3σ
- ±5 μm
- Max UPH (no dip)
- 10,000
M18 Ag
SiC Pre-Sintering Die Bonder
- XY accuracy @3σ
- ±10 μm
- UPH (paste)
- 1,500
M18 Power Series
Multi-Chip Die Bonder for IGBT / IPM
- Bond heads (Max / Neat)
- 6
- UPH (Max / Neat)
- 3,200
A11
Multi-Chip FC Module Integrated Bonder
- Bond heads
- 11
- Material types
- 8
M18 Rivet
Copper Pin / Rivet Placement System
- UPH
- ≥9,000
- Nozzles
- 24
M18 Sense
Sensor & TO Die Bonder
- XY @3σ (bottom cam / upgrade)
- ±10 μm
- UPH
- 1,000
WB20
Ultrasonic Wedge Wire Bonder
- XY bond accuracy
- ≤±0.2 μm
- Max wires/hr
- 12,000
Thin, odd-shaped and mixed-material die, bonded without cracks.
ENG builds its own motion, vision and process control, so temperature, force, speed, accuracy and acceleration are tuned together for each die. It runs silicon, SiC, GaN and GaAs, up to co-packaged optics structures.
- Thinnest die
- 50 μm
- Bond force
- 20-200 g
- Local placement
- ±1 μm @3σ
- C20 coupling
- 50-100 nm
Start from your process.
Seven application notes. Each one covers the hard part, how the machine handles it, and what to test.
All applicationsOptical module die bonding
Place VCSEL, PD, MPD, TIA and COC die to ±3 μm @3σ, and passive parts, isolators, windows, FA, with UV cure in the same line.
Eutectic die bonding
EX20 forms an atomic-level eutectic bond with ±1.5 μm @3σ placement, two alternating heating stations and fully programmable multi-stage profiles.
CPO fiber coupling
C20 couples single or dual lenses to 50-100 nm with ≤±0.3 μm XY, real-time optical power feedback and full data traceability.
SiC sintering die attach
Silver-paste and silver-film pre-sintering for SiC, six-head multi-chip bonding for IGBT and IPM, and one-machine module assembly.
MEMS / sensor die bonding
Pick and place fragile MEMS die without touching the membrane, then wedge-bond with Al or Au wire.
Flip chip bonding
A19 FC: 12 bond heads on two gantries, ±5 μm @3σ global accuracy, up to 10,000 UPH.
Die sorting
S17 sorts, flips and transfers die from 0.2 mm to 16 mm at up to 7,000 UPH.
From one machine to a complete line.
ENG has delivered complete IGBT lab lines with die attach, gold ball bonding, heavy aluminum wire bonding and vacuum soldering, configured around the customer's process.
How a project runsWhy engineers shortlist ENG.
Specs in the open
±3 μm @3σ optical die bonding, ±1.5 μm @3σ eutectic and 50-100 nm coupling, with the full parameter table on every machine page.
Configured to your die
Fixtures, heads and process recipes are built around your parts. R&D is 40% of a 400+ person company holding 70+ invention patents.
Engineers in Southeast Asia
ENG has an overseas headquarters in Singapore, an engineering center in Penang and a process service center in Bangkok.
Lower cost of ownership
Comparable-class precision at a more competitive cost, flexible customization and 7×24 remote support.
Free sample bonding, in four steps.
Most evaluations start with your own die on the matching machine. You see the result before any quotation.
Start a sample evaluation- Share your partsDie type, size and thickness, substrate, attach material and accuracy target.
- Machine matchAn ENG engineer picks the machine and process window for your parts.
- Sample bondingYour samples are bonded on that machine at ENG's process lab.
- ReportPlacement and process results come back to you with a configuration proposal.
Die bonder questions, answered.
What placement accuracy do ENG die bonders reach?
The G19 Series places optical die at ±3 μm @3σ, the EX20 eutectic bonder at ±1.5 μm @3σ, and the C20 coupling system reaches 50-100 nm coupling accuracy with ≤±0.3 μm local XY accuracy. Full parameter tables are on each machine page.
Which ENG machines handle SiC power module die attach?
The M18 Ag and Ag Pro run silver-paste and silver-film pre-sintering with heated heads to 300 ℃ ±2 ℃ and 0.3-300 N bond force. The M18 Power series places IGBT and FRD die, preforms and pins with six heads at up to 3,200 UPH.
Can we test our own parts before buying?
Yes. Send die, substrate and your accuracy target. ENG engineers bond your samples on the matching machine and report the outcome, free of charge.
Where is service and process support located?
ENG has an overseas headquarters in Singapore, an engineering center in Penang, a process service center in Bangkok and an R&D engineering center in Fukuoka, plus 7×24 remote diagnostics and maintenance.
How many ENG machines are in production?
More than 1,500 machines at 200+ customers since 2016: 800+ on optical module lines, 650+ on power module lines and 100+ on sensor lines.
Who is BondVane?
BondVane is an authorized overseas sales agent for Energy Intelligent Equipment (Wuxi) Co., Ltd.. Quotations come from BondVane, with ENG engineers on technical questions, sample bonding and installation.
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation