High-Precision Die Bonder

G19 Series

±3 μm @3σ die bonder for VCSEL, PD, TIA and COC in 800G / 1.6T optical modules

XY accuracy @3σ: ±3 μm
Angle (Plus / Pro): ±0.1°
Max UPH (G19): 1,200
Die size: 0.2-10 mm

ENG G19 Series High-Precision Die Bonder

What it does

The G19 platform is ENG's dedicated high-precision die bonder for optical communication. Through-hole positioning holds placement accuracy to ±3 μm @3σ, while a dual-bond-head design keeps throughput around 1,000 UPH. It supports dispensing, dipping and spot UV-cure epoxy processes.

Suitable for

VCSEL, PD, MPD and TIA die
COC (chip-on-carrier) and LED die
Sensor die in TO headers, ceramic rings and ceramic packages

Optical module die bonding MEMS / sensor die bonding

Highlights

±3 μm @3σ local XY accuracy on all three models
6 automatic ejector-needle changes and 6 automatic nozzle changes
Epoxy dispensing / writing, dipping, and UV epoxy with spot cure (G19, G19 Pro)
G19 Plus and Pro run left-in / right-out for inline automation; Pro is multi-head inline
Wafer map read & generate (optional)

G19 / G19 Plus / G19 Pro specifications

Manufacturer data, H1 2026. Throughput is under the stated standard conditions. Final values are confirmed in the technical agreement for your process.

Parameter	G19	G19 Plus	G19 Pro
Max XY accuracy (local)	±3 μm @3σ	±3 μm @3σ	±3 μm @3σ
Angle (local)	±1° @3σ	±0.1° @3σ	±0.1° @3σ
Wafer	Wafer frame 6/8/12 in; wafer ring 6/8 in; Gel-Pak loading fixture	3× 6 in wafers or 1× 8 in; 2/4 in Gel-Pak or waffle tray	Wafer frame / ring 6/8 in; 2/4 in Gel-Pak or waffle tray
Work table	L220 × W80-160 mm	L200 × W80-170 mm	L280 × W80-160 mm
Die size / thickness	0.2-10 mm; ≥70 μm	0.2-10 mm; ≥70 μm	0.2-10 mm; ≥70 μm
Material flow	Single in / single out	Left-in right-out, inline, single head	Left-in right-out, inline, multi-head
Footprint (excl. tower light)	2393 × 1384 × 1950 mm	1700 × 1420 × 1880 mm	2265 × 1284 × 1775 mm
Weight	≈2400 kg	≈2500 kg	≈2200 kg
Bond force	20-50 g ±5 g / 50-200 g ±10%	20-50 g ±5 g / 50-200 g ±10%	Blade-motor force control, 20-50 g ±5 g / 50-200 g ±10%
Auto ejector-needle change	6	6	6
Auto nozzle change	6	3 left + 3 right	6
Epoxy processes	Dispense / write, dip, UV (spot cure)	Dispense / write, dip	Dispense / write, dip, UV (spot cure)
Throughput	Max 1,200 pcs/hr (8 in wafer, 0.8 × 0.8 mm die, ≥100 μm)	Max 800 pcs/hr (6 in wafer, 0.8 × 0.8 mm die, ≥100 μm)	Max 1,000 pcs/hr (depends on loading, die size, process)
Inspection	Ink-dot recognition, die-defect similarity recognition
Safety	Deionizer, light curtain at operator window
Access control	Operator / engineer permission levels; wafer map read & generate (optional)

Options: Wafer stage options: 6/8/12 in wafer ring, 2/4 in waffle packs. Tray: 2/4 in waffle packs or custom fixtures.

In production

Optical module

Sorting, transfer and placement in an optical module fab

Process guides

AuSn eutectic die bonding: setting the process window for laser die

AuSn 80/20 eutectic die bonding for laser die: peak temperature, time at peak, ramp rate, atmosphere, preform size and placement, with public sources.