ENG packaging equipment

Die bonders, eutectic bonders, flip chip bonders, coupling systems, die sorters and wire bonders. Every machine page carries the manufacturer's full parameter table.

AI optical modules

G19 Series

High-Precision Die Bonder

XY accuracy @3σ: ±3 μm
Angle (Plus / Pro): ±0.1°

EX20

High-Precision Eutectic Die Bonder

XY accuracy @3σ: ±1.5 μm
Heating range: RT-450 ℃

C20

Fully Automatic Active Alignment & Coupling System

XY accuracy (local): ≤±0.3 μm
Coupling accuracy: 50-100 nm

M18-UV

Passive Component Die Bonder with UV Cure

XY accuracy @3σ: ±10 μm
Angle @3σ: ±0.5°

Power modules

M18 Ag

SiC Pre-Sintering Die Bonder

XY accuracy @3σ: ±10 μm
UPH (paste): 1,500

M18 Power Series

Multi-Chip Die Bonder for IGBT / IPM

Bond heads (Max / Neat): 6
UPH (Max / Neat): 3,200

A11

Multi-Chip FC Module Integrated Bonder

Bond heads: 11
Material types: 8

M18 Rivet

Copper Pin / Rivet Placement System

UPH: ≥9,000
Nozzles: 24

Sensors and MEMS

M18 Sense

Sensor & TO Die Bonder

XY @3σ (bottom cam / upgrade): ±10 μm
UPH: 1,000

WB20

Ultrasonic Wedge Wire Bonder

XY bond accuracy: ≤±0.2 μm
Max wires/hr: 12,000

Advanced packaging

A19 FC

Flip Chip Bonder

XYθ global @3σ: ±5 μm
Max UPH (no dip): 10,000

Die sorting, all lines

S17 Series

High-Precision Die Sorter

UPH (S17): ≥7,000
Best XY @3σ (S17 Pro): ±15 μm

Process support

AOI, plasma, wafer prep

IPQC AOI, PL20 plasma cleaner, SD21 expander, TM21 taping

Send us your die. We'll bond it.

Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.

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SendDie, substrate and target accuracy, under NDA if needed
BondENG engineers run your parts on the matching machine
ReportPlacement accuracy, process notes and a machine recommendation