SiC sintering die attach and IGBT / IPM module assembly
Silver-paste and silver-film pre-sintering for SiC, six-head multi-chip bonding for IGBT and IPM, and one-machine module assembly.
The hard part
Power die run from 2 mm to 15 mm and get thinner each generation. SiC modules for EV traction and inverters move to sintered silver, which needs heat, force and oxidation control during placement, on parts that crack easily.
How ENG equipment handles it
- M18 Ag / Ag Pro: heated heads to 300 ℃ ±2 ℃, 0.3-300 N, inert-gas protection, nano-silver paste / film and nano-copper.
- M18 Power series: six heads pick different die and preforms, up to 3,200 UPH.
- A11: 11 heads, up to 8 materials, 120-150 DBC/hr for multi-chip FC modules.
- Rivet: ≥9,000 UPH copper pins; S17 for IGBT / FRD / SiC sorting.
Machines to evaluate
M18 Ag
SiC Pre-Sintering Die Bonder
- XY accuracy @3σ
- ±10 μm
- UPH (paste)
- 1,500
M18 Power Series
Multi-Chip Die Bonder for IGBT / IPM
- Bond heads (Max / Neat)
- 6
- UPH (Max / Neat)
- 3,200
A11
Multi-Chip FC Module Integrated Bonder
- Bond heads
- 11
- Material types
- 8
M18 Rivet
Copper Pin / Rivet Placement System
- UPH
- ≥9,000
- Nozzles
- 24
S17 Series
High-Precision Die Sorter
- UPH (S17)
- ≥7,000
- Best XY @3σ (S17 Pro)
- ±15 μm
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation