ENG builds the machines. BondVane brings them to your fab.
Energy Intelligent Equipment (Wuxi) Co., Ltd. (ENG) designs and builds equipment for semiconductor advanced packaging. BondVane represents ENG outside China: application consulting, quotations, sample evaluation and coordination of installation and service.
The manufacturer
Founded in 2016 in Wuxi, ENG is a national-level specialized "Little Giant" and a national high-tech enterprise in China, focused on optical modules, power modules, memory and sensors.
Core team members come from Nanyang Technological University (Singapore), Tsinghua University and Harbin Institute of Technology; the executive team includes specialists from Singapore, Japan and Taiwan. The 15,000 m² site has high-standard cleanrooms and three core labs (advanced packaging process, precision motion control, precision vision) plus 3D-stacking and temperature and pressure test platforms. A new 45,000 m² R&D and manufacturing base has broken ground.
- Founded
- 2016
- Employees
- 400+
- R&D staff
- 40%
- Patents filed
- 170+
- Patents granted
- 120+
- Invention patents
- 70+
- Customers
- 200+
- Site
- 15,000 m²
1,500+ machines delivered, by production line.
- S17, since 2017
- 650+
- T18 / G19, since 2020
- 400+
- M18, since 2018
- 450+
Units delivered by model family. Data as of H1 2026, from the manufacturer.
Engineering close to your fab
Six sites, three of them in Southeast Asia and Japan, so sample runs, installation and service do not wait on a flight from Wuxi.
- Wuxi, ChinaHeadquarters, R&D and manufacturing
- Shenzhen, Wuhan, Shanghai, ChengduR&D centers in China
- SingaporeOverseas headquarters
- Penang, MalaysiaEngineering center
- Bangkok, ThailandProcess service center
- Fukuoka, JapanR&D engineering center
From sorter to CPO
- 2016: ENG founded in Wuxi
- 2017: S17 die sorter; 2018: M18 multi-chip die bonder
- 2020: T18 and G19 high-precision bonders for optical modules
- Since then: M18 Max for IGBT, EX20 eutectic, A19 FC flip chip, M18 Ag for SiC, M18-UV and C20 coupling
Who you work with
BondVane is an authorized overseas sales agent of ENG and a trading name of Wenchang Xinbofan Trading Co., Ltd. (Hainan, China). We handle your enquiry end to end in English, arrange NDAs, sample evaluations and factory visits, and coordinate ENG's engineering and service teams.
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation