Fully Automatic Active Alignment & Coupling System
C20
Automatic lens coupling for silicon-photonics modules and CPO optical engines
- XY accuracy (local)
- ≤±0.3 μm
- Coupling accuracy
- 50-100 nm
- Linear accuracy
- ≤50 nm
- Takt per part, single lens
- 2-5 min

What it does
C20 couples lenses for high-speed silicon-photonics modules and CPO optical engines. A dedicated optical-path compensation and vibration-damped structure deliver linear accuracy of ≤50 nm. Fiber plug-in/out is automatic, optical power is sampled in real time, and dispensing is precise.
Suitable for
- High-speed silicon-photonics optical modules
- CPO (co-packaged optics) optical engines
- Single-lens and dual-lens coupling
Highlights
- Automatic fiber insertion and removal
- Real-time optical power acquisition
- Precision dispensing
- Full production-data traceability, MES connection
- Automatic loading/unloading extension available
C20 (single lens / dual lens) specifications
Manufacturer data, H1 2026. Throughput is under the stated standard conditions. Final values are confirmed in the technical agreement for your process.
| Parameter | C20 single lens | C20 dual lens |
|---|---|---|
| Max XY accuracy (local) | ≤±0.3 μm | ≤±0.3 μm |
| Angle (local) | ≤±0.003° | ≤±0.003° |
| Coupling accuracy | 50-100 nm | 50-100 nm |
| UPH | 12 pcs/hr | 8 pcs/hr |
| Lens size | R0.8-3 mm, L2-7 mm | R0.8-3 mm, L2-7 mm |
| Production takt | 2-5 min/part | 6-8 min/part |
| Work table | 1000 × 800 mm | 1000 × 800 mm |
| Head function | Lens vacuum pick or micro electric gripper | Lens vacuum pick or micro electric gripper |
| Footprint | 1050 × 850 × 1870 mm | 1050 × 850 × 1870 mm |
| Weight | 580 kg | 600 kg |
| Inspection | Lens position and appearance | Lens position and appearance |
| Access control | 3 levels (operator, engineer, admin) | 3 levels (operator, engineer, admin) |
| Option | Automatic loading/unloading | Automatic loading/unloading |
Test your die on the C20.
Send die and substrate samples or drawings. ENG engineers run a sample bonding and report placement accuracy and process results, free of charge.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation


