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Free sample bonding

Fully Automatic Active Alignment & Coupling System

C20

Automatic lens coupling for silicon-photonics modules and CPO optical engines

XY accuracy (local)
≤±0.3 μm
Coupling accuracy
50-100 nm
Linear accuracy
≤50 nm
Takt per part, single lens
2-5 min
ENG C20 Fully Automatic Active Alignment & Coupling System

What it does

C20 couples lenses for high-speed silicon-photonics modules and CPO optical engines. A dedicated optical-path compensation and vibration-damped structure deliver linear accuracy of ≤50 nm. Fiber plug-in/out is automatic, optical power is sampled in real time, and dispensing is precise.

Suitable for

  • High-speed silicon-photonics optical modules
  • CPO (co-packaged optics) optical engines
  • Single-lens and dual-lens coupling

Highlights

  • Automatic fiber insertion and removal
  • Real-time optical power acquisition
  • Precision dispensing
  • Full production-data traceability, MES connection
  • Automatic loading/unloading extension available

C20 (single lens / dual lens) specifications

Manufacturer data, H1 2026. Throughput is under the stated standard conditions. Final values are confirmed in the technical agreement for your process.

ParameterC20 single lensC20 dual lens
Max XY accuracy (local)≤±0.3 μm≤±0.3 μm
Angle (local)≤±0.003°≤±0.003°
Coupling accuracy50-100 nm50-100 nm
UPH12 pcs/hr8 pcs/hr
Lens sizeR0.8-3 mm, L2-7 mmR0.8-3 mm, L2-7 mm
Production takt2-5 min/part6-8 min/part
Work table1000 × 800 mm1000 × 800 mm
Head functionLens vacuum pick or micro electric gripperLens vacuum pick or micro electric gripper
Footprint1050 × 850 × 1870 mm1050 × 850 × 1870 mm
Weight580 kg600 kg
InspectionLens position and appearanceLens position and appearance
Access control3 levels (operator, engineer, admin)3 levels (operator, engineer, admin)
OptionAutomatic loading/unloadingAutomatic loading/unloading

Test your die on the C20.

Send die and substrate samples or drawings. ENG engineers run a sample bonding and report placement accuracy and process results, free of charge.

  1. SendDie, substrate and target accuracy, under NDA if needed
  2. BondENG engineers run your parts on the matching machine
  3. ReportPlacement accuracy, process notes and a machine recommendation
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