High-Precision Die Sorter
S17 Series
Die sorting, flipping and transfer for optical, power and MEMS die
- UPH (S17)
- ≥7,000
- Best XY @3σ (S17 Pro)
- ±15 μm
- Max wafer (Plus / Pro)
- 12 in
- Die size
- 0.2-16 mm
What it does
S17 is a full-function sorter. Vertical through-pick shortens motion travel to raise UPH, and 90° / 180° flip handles difficult loading cases. Sorting modes include wafer-to-tray, wafer-to-wafer and tray-to-wafer.
Suitable for
- Optical: VCSEL, COC, TIA, PD, MPD, submounts, lenses and windows
- Power: IGBT, FRD and SiC die
- MEMS sensors, microphones, pressure, inertial and automotive sensors
Highlights
- Wafer-to-tray, wafer-to-wafer and tray-to-wafer
- 0° / 90° / 180° flip (S17 Pro: flip FC, bottom UL, pre-placement stage)
- Automatic voice-coil force control on Plus and Pro
- Wafer map read & generate (optional)
S17 / S17 Plus / S17 Pro specifications
Manufacturer data, H1 2026. Throughput is under the stated standard conditions. Final values are confirmed in the technical agreement for your process.
| Parameter | S17 | S17 Plus | S17 Pro |
|---|---|---|---|
| Pick method | Rotary swing-arm pick | Vertical through-pick | Vertical through-pick |
| XY accuracy (local) | ±38 μm @3σ (die ≥5×5 mm); ±25 μm @3σ (die <5×5 mm) | ±38 μm @3σ (die ≥5×5 mm); ±25 μm @3σ (die <5×5 mm) | ±38 μm @3σ standard; ±25 μm @3σ (≥5×5 mm); ±15 μm @3σ (<5×5 mm) |
| Angle (local) | ±3° @3σ | ±2° @3σ | ±2° @3σ |
| Wafer size | Max 8 in | Max 12 in | Max 12 in |
| Head θ range | NA | 0-360° | 0-360° |
| Z stroke | 8 mm | 60 mm | 60 mm |
| Work table | 8 in ring: max 130×220 mm; 6 in ring: max 180×220 mm | Max 200×220 mm | Max 200×220 mm |
| Throughput | ≥7,000 pcs/hr (8 in frame, film-to-film, 0.8×0.8 mm) | ≥3,000 pcs/hr (8 in frame, film-to-film, 0.8×0.8 mm) | ≥2,000 pcs/hr at 90° / ≥3,000 pcs/hr at 180° (8 in ring, 0.2×0.2 mm) |
| Die size | 0.2-16 mm | 0.2-16 mm | 0.2-16 mm |
| Die thickness | ≥70 μm | ≥70 μm | ≥70 μm |
| Force control | Manual spring, 30-200 g | Voice-coil, 20-50 g ±5 g / 50-200 g ±10% | Voice-coil, 20-50 g ±5 g / 50-200 g ±10% |
| Footprint (excl. tower light) | 1200 × 900 × 1600 mm | 1700 × 1400 × 1800 mm | 1400 × 1660 × 2050 mm |
| Weight | ≈700 kg | ≈1600 kg | ≈1800 kg |
| Input | 6/8 in wafer frame or ring; 2/4 in waffle tray and Gel-Pak | 6/8/12 in frame or ring; 4 in waffle/Gel-Pak ×4; 2 in ×1; custom box max 120×120 mm | Same as S17 Plus |
| Output | 6 in wafer ring; 4 in waffle/Gel-Pak ×2; 2 in ×6; no wafer frame | 6/8 in frame or ring; 4 in waffle/Gel-Pak ×4; 2 in ×9; custom box max 200×220 mm | Same as S17 Plus |
| Inspection | Ink-dot recognition, die-defect similarity recognition | ||
| Safety | Deionizer, light curtain at operator window | ||
| Access control | Operator / engineer permission levels; wafer map read & generate (optional) | ||
Often evaluated with
Test your die on the S17 Series.
Send die and substrate samples or drawings. ENG engineers run a sample bonding and report placement accuracy and process results, free of charge.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation