High-throughput flip chip bonder for FCBGA, FCCSP and FC QFN
A19 FC: 12 bond heads on two gantries, ±5 μm @3σ global accuracy, up to 10,000 UPH.
The hard part
Flip chip packages need fine placement at very high volume, integrated flux dipping, and a machine that talks SECS/GEM to the rest of the line.
How ENG equipment handles it
- Each gantry picks 6 die at once; 12 heads total.
- Max 8,000 UPH with dipping, 10,000 without, at 5 μm.
- Bond force 50-3,000 g open/closed loop.
- SECS/GEM, SMEMA, TCP/IP; Class 1,000 (ISO 6).
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation