Automatic active alignment for silicon photonics and CPO optical engines
C20 couples single or dual lenses to 50-100 nm with ≤±0.3 μm XY, real-time optical power feedback and full data traceability.
The hard part
Silicon photonics and co-packaged optics move the optical interface onto the package. Coupling tolerance is in the tens of nanometres, manual alignment does not scale, and every part needs a data record.
How ENG equipment handles it
- Dedicated optical-path compensation and vibration-damped structure, linear accuracy ≤50 nm.
- Automatic fiber insertion and removal, real-time optical power acquisition.
- Precision dispensing and lens handling by vacuum or micro gripper.
- MES connection and full production-data traceability; auto loading available.
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation