Eutectic die bonder for EML, LD and COC laser chips
EX20 forms an atomic-level eutectic bond with ±1.5 μm @3σ placement, two alternating heating stations and fully programmable multi-stage profiles.
The hard part
High-power laser die for 5G and datacom need a void-free metallurgical joint for heat and an exact optical position. Temperature, pressure and timing all have to be repeatable bond to bond.
How ENG equipment handles it
- ±1.5 μm @3σ XY, ±0.2° @3σ angle.
- RT-450 ℃, ±5 ℃ control, ramp up to >100 ℃/s.
- Each profile stage sets time, nozzle pressure, ramp rate and temperature independently.
- Two heating stations alternate so one cools while the other bonds.
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation