ENG equipment in production
Technical case notes from optical module, power module, sensor and research customers. Customer names are withheld; references can be arranged under NDA.
Optical module
Optical die sorting, 90° flip and burn-in transfer
Optical module
Sorting, transfer and placement in an optical module fab
Power module
Large, ultra-thin SiC die in power modules
Power module
Automotive and inverter power module line
Sensor / MEMS
Fragile MEMS sensor die: safe pick and place
Sensor / MEMS
Custom 180° flip and bottom inspection for MEMS
Sensor / MEMS
Long loops, high density, fine pitch wire bonding
Research
Wire bonding for a university IC lab
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation