Optical module die bonders for 800G and 1.6T transceivers
Place VCSEL, PD, MPD, TIA and COC die to ±3 μm @3σ, and passive parts, isolators, windows, FA, with UV cure in the same line.
The hard part
AI datacenter transceivers at 800G and 1.6T pack more lanes into the same module. Die are 0.25-1 mm, often fragile, and lens and fiber alignment downstream only works if the die sit exactly where the design says. That pushes die-attach accuracy into the low single microns while UPH still has to support volume.
How ENG equipment handles it
- G19 for active die: ±3 μm @3σ local accuracy, dual bond heads, max 1,200 UPH, dispensing / dipping / spot-UV epoxy.
- EX20 where the process is eutectic (EML, LD, COC): ±1.5 μm @3σ, RT-450 ℃.
- M18-UV for passive parts: isolators, magnets, windows, spacers, FA, Mux/Demux, with spot and area UV curing.
- S17 upstream to sort, flip and transfer optical die and lenses from wafer.
Machines to evaluate
G19 Series
High-Precision Die Bonder
- XY accuracy @3σ
- ±3 μm
- Angle (Plus / Pro)
- ±0.1°
EX20
High-Precision Eutectic Die Bonder
- XY accuracy @3σ
- ±1.5 μm
- Heating range
- RT-450 ℃
M18-UV
Passive Component Die Bonder with UV Cure
- XY accuracy @3σ
- ±10 μm
- Angle @3σ
- ±0.5°
S17 Series
High-Precision Die Sorter
- UPH (S17)
- ≥7,000
- Best XY @3σ (S17 Pro)
- ±15 μm
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation