SiC Pre-Sintering Die Bonder
M18 Ag
Silver-paste and silver-film pre-sintering die attach for SiC power modules
- XY accuracy @3σ
- ±10 μm
- UPH (paste)
- 1,500
- Heated head
- 300 ℃
- Wafer
- 12 in
What it does
M18 Ag places SiC die for TPAK, HPD and DCM modules with heated bond heads and a pre-heated work table, reducing efficiency loss from temperature changes. An inert-gas protection system prevents oxidation. It supports nano-silver paste, nano-silver film and nano-copper processes.
Suitable for
- SiC die in TPAK, HPD and DCM modules
- DTS and PTC pre-sintering placement
- Nano-silver paste, nano-silver film and nano-copper processes
Highlights
- Dual heated bond heads (Ag Pro), 300 ℃ ±2 ℃
- Heated work table and pre-heat zone
- Inert-gas anti-oxidation protection
- Wafer, DBC and AMB barcode traceability
- Over-temperature alarm on heads and platform
M18 Ag / M18 Ag Pro specifications
Manufacturer data, H1 2026. Throughput is under the stated standard conditions. Final values are confirmed in the technical agreement for your process.
| Parameter | M18 Ag | M18 Ag Pro |
|---|---|---|
| Process | Silver paste, silver film | Silver paste, silver film |
| Max XY accuracy (local) | ±10 μm @3σ | ±10 μm @3σ |
| Angle (local) | ±0.5° @3σ | ±0.1° @3σ |
| Throughput | ≥1,500 pcs/hr (depends on process) | 1,500 pcs/hr (paste, 150 ms hold); 1,000 pcs/hr (film: stamp 200 ms, bond 800 ms) |
| Die size | 1-20 mm | 1-20 mm |
| Die thickness | ≥70 μm | ≥70 μm |
| Work table | Auto-width 3-section track, 120-260 mm | Auto-width 3-section track, 120-260 mm |
| Wafer | Expansion ring 6/8/12 in; 360° wafer rotation; 6/8/12 in cassette | Expansion ring 6/8/12 in; 360° wafer rotation; 6/8/12 in cassette |
| Loading | Auto load/unload, cassette, tape feeder ×2, 4 in tray | Auto load/unload, cassette, tape feeder ×2, 4 in tray |
| Bond heads | Heated ×1 + cold ×1 (optional) | Heated ×2 |
| Head temperature | 300 ℃ ±5 ℃ | 300 ℃ ±2 ℃ |
| Heated head force | 10-300 N, ±10% | 0.3-300 N, ±10% |
| Table heating | Max 300 ℃ ±5 ℃ | Max 300 ℃ ±2 ℃ |
| Pre-heat zone | , | Max 300 ℃ ±2 ℃ |
| Auto ejector change | 6 | 6 |
| Auto head change | 5 | 10 |
| Footprint (excl. tower light) | 1950 × 1950 × 2050 mm | 1752 × 1940 × 1800 mm |
| Weight | ≈2500 kg | ≈2500 kg |
| Options | Wafer/DBC/AMB barcode traceability; over-temperature alarm; pre-placement stage / bottom camera | Same |
| Inspection | Ink-dot recognition, die-defect similarity recognition | |
| Safety | Deionizer, light curtain at operator window | |
| Access control | Operator / engineer permission levels; wafer map read & generate (optional) | |
Test your die on the M18 Ag.
Send die and substrate samples or drawings. ENG engineers run a sample bonding and report placement accuracy and process results, free of charge.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation