Sorting, transfer and placement in an optical module fab
Optical module
Requirement
Die of 0.25-1 mm for 40G-1.6T communication and datacom products, with optical, electrical and lens processes to cover.
Solution
- S17 series sorters and T18 series bonders installed in 2020.
- Sorting, transfer and placement functions matched to the customer's optical, electrical and lens process requirements.
Result
Per the manufacturer, the customer rated the inspection data and machine performance highly.
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation