Passive Component Die Bonder with UV Cure
M18-UV
Automated placement of isolators, magnets, windows and FA in 100G-1.6T modules
- XY accuracy @3σ
- ±10 μm
- Angle @3σ
- ±0.5°
- Part size
- 0.3-15 mm
- Flip + flat placement
- 90°
What it does
M18-UV combines vision recognition, UV-epoxy dispensing and writing, and spot or area UV curing in one passive-component bonder. A new architecture avoids magnetic interference from the parts, and fixed-range force control handles magnetic materials.
Suitable for
- Isolators and magnets
- Windows and spacers
- FA and Mux/Demux
- Passive parts for 100G, 200G, 400G, 800G and 1.6T optical modules
Highlights
- Spot-light and area-light UV curing
- Epoxy dispensing and writing
- 90° flip and flat placement
- Auto-adjusting 3-section track, 80-140 mm
- PCBA barcode traceability and bottom-camera positioning (options)
M18-UV specifications
Manufacturer data, H1 2026. Throughput is under the stated standard conditions. Final values are confirmed in the technical agreement for your process.
| Max XY accuracy (local) | ±10 μm @3σ |
|---|---|
| Angle (local) | ±0.5° @3σ |
| Throughput | 500 pcs/hr (excluding process time) |
| Part size | 0.3-15 mm |
| Part thickness | ≥70 μm |
| UV | Spot-light and area-light UV curing |
| Track | Auto width adjustment, 3-section, 80-140 mm |
| Loading | Custom loading/unloading fixtures to the customer's parts |
| Bond force | 20-50 g ±5 g / 50-200 g ±10%; auto height sensing; fixed-range force control for magnetic parts |
| Dispensing | Dot and write |
| Flip | 90° flip and flat placement |
| Footprint (excl. tower light) | 2250 × 1800 × 1800 mm |
| Weight | ≈2000 kg (incl. granite frame and platform) |
| Inspection | Reject recognition, part-defect similarity recognition |
| Access control | 3 levels (operator, engineer, admin); wafer map read & generate (optional) |
| Options | PCBA barcode traceability; bottom-camera positioning logic |
| Inspection | Ink-dot recognition, die-defect similarity recognition |
| Safety | Deionizer, light curtain at operator window |
| Access control | Operator / engineer permission levels; wafer map read & generate (optional) |
Test your die on the M18-UV.
Send die and substrate samples or drawings. ENG engineers run a sample bonding and report placement accuracy and process results, free of charge.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation