AOI, plasma cleaning and wafer prep
Supporting equipment that completes a packaging line, often used by labs and new lines setting up a full process.
IPQC SV-65DT AOI
Compact AI-assisted optical inspection for die attach, wire bonding and frame attach.
| Footprint, weight | 800 × 800 × 1700 mm, ≈320 kg |
|---|---|
| XYZ travel | 300 × 200 × 200 mm |
| Positioning accuracy | Up to 5 μm |
| Cameras | 20 MP locating; 65 MP inspection; optional 3D |
| Objectives | 5×, 10×, 20×, 50× (auto changer optional) |
| Pixel resolution | 0.065 μm/pix (65 MP + 50×) |
| Detection accuracy | 0.65 μm (65 MP + 50×) |
| Focus | Point-laser autofocus, 100 ms |
| False / missed call | 1% / 0.1-0.5% (product dependent) |
| Throughput | >1,200 pcs/hr |
| Loading | Tray, wafer, Gel-Pak |
PL20 MA vacuum plasma cleaner
Removes pad oxides to strengthen wire bonds and removes epoxy bleed to improve molding reliability, for optoelectronic, IGBT, MEMS and CMOS packaging.
| Generator | 40 kHz / 13.56 MHz (optional) |
|---|---|
| Chamber | 60 / 110 / 150 / 180 / 200 L |
| Power | 0-1000 W adjustable |
| Gas | 2 channels (expandable): Ar, N₂, H₂, CF₄, O₂; MFC 0-500 sccm ±2% |
| Vacuum | 9-30 Pa; oil pump + Roots pump |
| Chamber material | Imported 316 stainless steel |
| Chamber temperature | <30 ℃ |
| Control | PLC + HMI, in-house software V2.0 |
SD21-6 semi-automatic wafer expander
Simple, operator-friendly die expansion for LEDs, small and medium power transistors and ICs.
| Size, weight | 500 × 350 × 650 mm, ≈35 kg |
|---|---|
| Wafer | 6 in, 8 in (4 in, 7 in and others) |
| Upper cylinder stroke | 400-500 mm |
| Lower cylinder stroke | 70-150 mm adjustable |
| Power | 220 VAC 50 Hz ±10%, 600 W |
| Air | 0.3-0.6 MPa |
| Recommended temperature | 55-60 ℃ |
TM21 manual wafer taping
Precision rails and imported temperature control for taping wafers, PCBs, LED boards, QFN, glass, camera modules and substrates before dicing.
| Models | TM21-6 / TM21-8 / TM21-12 |
|---|---|
| Product size | 3-6 in / 3-8 in / 3-12 in (custom sizes possible) |
| Ring | 6 / 8 / 12 in |
| Tape | UV tape, blue tape (roll) |
| Table heating | Room temp to 80 ℃ |
| Power | 220 V (customizable), 700 W |
| Air | 0.5-0.8 MPa |
| Weight | 90 kg |
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation