Custom 180° flip and bottom inspection for MEMS
Sensor / MEMS
Requirement
MEMS die of 0.2-20 mm for handheld devices, body-temperature sensing, power monitoring and outdoor products, with the customer requiring 180° flip and bottom inspection.
Solution
- Customized solution adding 180° flip and bottom-side inspection.
Result
Met the precision requirements across the customer's application scenarios.
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation