Sensor & TO Die Bonder

M18 Sense

Membrane-safe die bonding for MEMS pressure, gravity and TO-header sensors

XY @3σ (bottom cam / upgrade): ±10 μm
UPH: 1,000
Die size: 0.2-8 mm
Die thickness: ≥70 μm

What it does

M18 Sense protects the membrane around the die during pick and ejection, then uses dot/write dispensing or dipping so the die seats fully on the substrate.

Suitable for

TO headers, ceramic rings and ceramic packages
MEMS pressure and gravity sensor die
LED die

MEMS / sensor die bonding

Highlights

Membrane-protecting pick and eject
Dot / write dispensing or dipping
Bottom camera / pre-placement stage options
Up to 8 in wafer (ring or frame)

M18 platform / M18-TO specifications

Manufacturer data, H1 2026. Throughput is under the stated standard conditions. Final values are confirmed in the technical agreement for your process.

Parameter	M18 platform	M18-TO
XY accuracy (local)	±38 μm @3σ; ±10 μm @3σ (bottom camera)	±15 μm @3σ; ±10 μm @3σ (upgrade)
Angle	±3° / ±1° (bottom camera)	±1°
Throughput	1,000 pcs/hr (8 in wafer, 0.8×0.8 mm, ≥100 μm)	600-1,000 pcs/hr (8 in wafer, 0.8×0.8 mm, ≥100 μm)
Die size	0.8-8 mm; 8-30 mm custom	0.2-5 mm; 5-10 mm custom
Die thickness	≥70 μm	≥70 μm
Work table	2 in waffle ×12, 4 in Gel-Pak ×4, custom box max 300×200 mm (or with bottom cam: ×6 / ×2 / 150×200 mm)	Custom box max 220×220 mm
Wafer	Frame 6/8 in; ring 6/8 in; 2 in waffle ×4; 4 in Gel-Pak ×1	Frame 6/8 in; ring 6/8 in; 2 in waffle ×4; 4 in Gel-Pak ×1
Loading	Manual; pre-placement stage or bottom camera optional	Manual
Head	Dispense, write and bond	Dot/write dispense or dip (one of two)
Force control	Voice-coil 20-50 g ±5 g / 50-200 g ±10%	Voice-coil 20-50 g ±5 g / 50-200 g ±10%
Footprint	≈1450 × 1000 × 1780 mm	≈1450 × 1100 × 1700 mm
Weight	≈1800 kg	≈1500 kg
Inspection	Ink-dot recognition, die-defect similarity recognition
Safety	Deionizer, light curtain at operator window
Access control	Operator / engineer permission levels; wafer map read & generate (optional)