Authorized overseas agent for Energy Intelligent Equipment (Wuxi) Co., Ltd.sales@bondvane.com+86 139 3944 9974
Free sample bonding

Fragile MEMS sensor die: safe pick and place

Sensor / MEMS

Fragile MEMS sensor die: safe pick and place

Requirement

MEMS die of 0.2-5 mm for consumer electronics, medical (wearables, appliances) and automotive (DPF pressure, vapor pressure sensors), fragile, with thin membranes and coatings.

Solution

  • A safe, reliable pick-and-place scheme for membrane and coated die.

Result

Stable handling of fragile sensor die across consumer, medical and automotive products.

Send us your die. We'll bond it.

Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.

  1. SendDie, substrate and target accuracy, under NDA if needed
  2. BondENG engineers run your parts on the matching machine
  3. ReportPlacement accuracy, process notes and a machine recommendation
WhatsApp