Long loops, high density, fine pitch wire bonding
Sensor / MEMS
Requirement
MEMS die of 0.2-20 mm for microphones, pressure, inertial and automotive sensing, with long wire loops, high density and small pitch.
Solution
- Wedge bonding process tuned for long loops at high density and small pitch.
Result
High-performance, high-reliability sensor packaging.
Machines in this case
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation