Ultrasonic Wedge Wire Bonder

WB20

Fine aluminum and gold wedge bonding for SAW filters, pressure, humidity and Hall sensors

XY bond accuracy: ≤±0.2 μm
Max wires/hr: 12,000
Al wire: 17.5-75 μm
Min pad: 63×63 μm

What it does

WB20 handles fine aluminum wire and (PRO) gold-wire wedge bonding across many products and carriers, with flexible customization for ultra-fine-pitch IC bonding.

Suitable for

SAW filters
Pressure, temperature/humidity and Hall sensors
Fine-pitch IC wire bonding
University and research labs

MEMS / sensor die bonding

Highlights

Al wire 17.5-75 μm; Au wire 17.5-50 μm (PRO, wedge)
Voice-coil bond force 15-250 g ±0.5 g
Transducer 64 kHz (WB20) or 100 / 140 kHz (PRO)
Pull strength ≥7 g (32 μm wire), ≥20 g (75 μm wire)

WB20 / WB20 PRO specifications

Manufacturer data, H1 2026. Throughput is under the stated standard conditions. Final values are confirmed in the technical agreement for your process.

Parameter	WB20	WB20 PRO
Bond accuracy	XY ≤±0.2 μm	XY ≤±0.2 μm
Wire clamp angle	30° / 45°	Max 90°
Work table	XY 110 × 110 mm; ±180° rotation; Z 25 mm	XY 110 × 110 mm; ±180° rotation; Z 25 mm
Bond power	0-10 W	0-10 W
Throughput	Max 12,000 wires/hr	Max 12,000 wires/hr
Footprint / weight	1000 × 800 × 1500 mm, ≈650 kg	1000 × 800 × 1500 mm, ≈650 kg
Bond force control	Voice-coil 15-250 g ±0.5 g	Voice-coil 15-250 g ±0.5 g
Wire	Al 17.5-75 μm	Al 17.5-75 μm; Au 17.5-50 μm (wedge)
Heating module	,	For Au wire, 25-200 ℃
Min pad size / pitch	63 × 63 μm / 68 μm	63 × 63 μm / 68 μm
Loading	Manual	Manual
Vacuum	<-0.8 bar (vacuum fixture)	<-0.8 bar (vacuum fixture)
Transducer frequency	64 kHz	100 kHz / 140 kHz
Cavity depth	3 mm	10 mm
Pressure	10-400 cN	10-400 cN
Pull strength	≥7 g (32 μm / 1.25 mil); ≥20 g (75 μm / 3 mil)	Same