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Free sample bonding

Large, ultra-thin SiC die in power modules

Power module

Large, ultra-thin SiC die in power modules

Requirement

Power module die of 2-15 mm for low- and medium/high-voltage drives, PV, new-energy vehicles, welders, UPS, power-quality monitoring and wind power. Very large and very thin SiC die had to be sorted, placed and inspected without damage.

Solution

  • Safe sorting of large, thin SiC die.
  • Placement and AOI steps configured for the module line.

Result

The equipment met the customer's requirements for safe sorting, placement and AOI on oversized, ultra-thin SiC die.

Send us your die. We'll bond it.

Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.

  1. SendDie, substrate and target accuracy, under NDA if needed
  2. BondENG engineers run your parts on the matching machine
  3. ReportPlacement accuracy, process notes and a machine recommendation
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