Multi-Chip Die Bonder for IGBT / IPM

M18 Power Series

Six-head multi-chip die bonder for IGBT and IPM power modules, up to 3,200 UPH

Bond heads (Max / Neat): 6
UPH (Max / Neat): 3,200
XY @3σ (upgrade): ±10 μm
Die size: 2-20 mm

ENG M18 Power Series Multi-Chip Die Bonder for IGBT / IPM

What it does

The six-head design, which won a patent gold award, picks different die or solder preforms at the same time to raise line UPH. It handles solder-paste and preform processes for silicon die, with optional alcohol spraying.

Suitable for

IGBT and FRD die
NTC, pin-holders, clips and power pins
Solder preforms and molybdenum plates (cold placement)
IGBT and IPM power modules

SiC sintering die attach

Highlights

Six heads pick different parts to the line's takt
Solder-paste and preform processes
DBC traceability, takt, UPH and alarm logs
EtherCAT bus control for MES/automation extension
Multi-wafer switching

MH20 / M18 Pro / M18 Max / M18 Neat specifications

Manufacturer data, H1 2026. Throughput is under the stated standard conditions. Final values are confirmed in the technical agreement for your process.

Parameter	MH20	M18 Pro	M18 Max	M18 Neat
XY accuracy (local)	±38 μm @3σ	±38 μm; ±25 μm @3σ (upgrade)	±38 μm; ±10 μm @3σ (upgrade)	±25 μm; ±10 μm @3σ (upgrade)
Angle (local)	±3° @3σ	±3° / ±2° @3σ	±2° / ±1° @3σ	±2° / ±1° @3σ
Throughput	≥5,000 pcs/hr (8 in wafer, fixture <150 mm, 0.8×0.8 mm, ≥100 μm)	≥1,500-2,000 pcs/hr (8 in wafer, 0.8×0.8 mm, ≥100 μm)	≥3,200 pcs/hr (by fixture matrix density)	≥3,200 pcs/hr (by fixture matrix density)
Die size	0.7-5 mm; 5-30 mm custom	1-15 mm; 15-30 mm custom	2-20 mm	2-20 mm
Die thickness	≥70 μm	≥70 μm	≥70 μm	≥70 μm
Work table	L300 × W70-250 mm	Auto/manual rail width; unload area L500 × W150-330 mm	L470 × W200-330 mm	L470 × W200-330 mm
Wafer	Frame 6/8/12 in	Frame 6/8/12 in; ring 6/8 in; 2 in waffle ×4; 4 in Gel-Pak ×1	Frame 6/8/12 in; 6/8/12 in cassette	Frame 6/8/12 in; 360° rotation; 6/8/12 in cassette
Bond heads	,	Dual	Six (option: four + dispensing)	Six (option: four + dispensing)
Force control	Voice-coil 20-50 g ±5 g / 50-200 g ±10%	Same	Same	Same
Footprint	≈1550 × 1500 × 1750 mm	≈1550 × 1990 × 1700 mm	≈2010 × 1950 × 2050 mm	≈1950 × 1900 × 1990 mm
Weight	≈1400 kg	≈2000 kg	≈2000 kg	≈2500 kg
Inspection	Ink-dot recognition, die-defect similarity recognition
Safety	Deionizer, light curtain at operator window
Access control	Operator / engineer permission levels; wafer map read & generate (optional)