Wire bonding for a university IC lab
Research
Requirement
A university's new IC college needed ultrasonic wire bonding for research and teaching: fine aluminum wire, 64 kHz transducer, 30° bond angle.
Solution
- WB20 configured for fine Al wire, 64 kHz, 30° wire clamp.
Result
A process platform for research verification and student experiments. ENG also delivers complete lab lines, e.g. an IGBT preform-process line.
Machines in this case
Send us your die. We'll bond it.
Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation