A18
AOI Die Sorter
Automated optical inspection and sorting for optical chips, with 3 μm detection in key areas and four end-face checks
- Best detection, key area
- 3 μm
- UPH, pick and place
- 600
- 2 top, 1 side, 1 bottom
- 4 CCD
- False reject rate
- 1-3%
What it does
A18 inspects each chip with four CCD cameras and autofocus, then picks and sorts it. It finds surface defects such as contamination, scratches, missing material, cracks and edge chipping, rotates the chip to check up to four end faces, reads characters by OCR and checks the wire state on COC chips. Results are combined with the loading map, output as coordinates and can be uploaded to or downloaded from MES.
Suitable for
- Optical communication chips and COC (chip on carrier)
- Chips that need end-face inspection on up to four sides
- Lines loading and unloading from Gel-Pak or tray
Highlights
- Best detection 3 μm in key areas, 65 μm in non-key areas
- Up to four end faces inspected by rotation, with autofocus
- OCR character recognition and COC wire-state check
- Automatic voice-coil force control, 20-50 g for optical chips
- Multi-bin sorting: main bin, secondary bin and AOI reject or re-inspection
- Results mapped to loading coordinates; MES upload and download
A18 specifications
Manufacturer brochure, October 2025. Values are for reference; final values are confirmed in the technical agreement for your process.
| Max detection capability | 3 μm (key area); 65 μm (non-key area) |
|---|---|
| Detection repeatability | ±10% |
| Cameras | 4 CCD: 2 top, 1 side, 1 bottom |
| False reject / escape rate | False reject 1-3%; escape 0.1-0.3% |
| Defect inspection | Surface defects: contamination, scratches, missing material, cracks, edge chipping |
| End-face inspection | Up to 4 faces by rotation, autofocus |
| Other inspection | OCR character recognition; COC wire-state check |
| Pick method | Vertical pick |
| XY accuracy (local) | X, Y ≤±38 μm |
| Placement angle | ≤±2° |
| Head θ range | 0-360° |
| Bond head force | Automatic voice-coil control, 20-50 g ±5 g / 50-100 g ±10% |
| Die size | 3.85 × 2.85 × 0.792 mm (overall part size) |
| Throughput | 600 pcs/hr (excluding OCR pre-scan and boat change time) |
| Loading | Magazine, 10 boats; 4 waffle packs per boat; 36 pcs per waffle pack |
| Unloading | 3 output zones: main bin, secondary bin, AOI reject or re-inspection; each a magazine of 10 boats × 4 waffle packs × 36 pcs |
| Data | Results combined with loading map, coordinate output, MES upload and download |
| Footprint (excl. tower light) | 1870 × 1234 × 1854 mm |
| Weight | ≈1600 kg (incl. marble frame and platform) |
Test your die on the A18.
Send die and substrate samples or drawings. ENG engineers run a sample bonding and report placement accuracy and process results, free of charge.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation