Authorized overseas agent for Energy Intelligent Equipment (Wuxi) Co., Ltd.sales@bondvane.com+86 139 3944 9974
Free sample bonding

Automotive and inverter power module line

Power module

Automotive and inverter power module line

Requirement

Die of 2-15 mm for automotive semiconductors, appliances, industrial, PV inverters and in-vehicle systems.

Solution

  • Sorting, placement and AOI for large and ultra-thin SiC die.

Result

Met the strict requirements for safe handling through sorting, placement and AOI.

Machines in this case

ENG M18 Power Series Multi-Chip Die Bonder for IGBT / IPM

M18 Power Series

Multi-Chip Die Bonder for IGBT / IPM

Bond heads (Max / Neat)
6
UPH (Max / Neat)
3,200
ENG A11 Multi-Chip FC Module Integrated Bonder

A11

Multi-Chip FC Module Integrated Bonder

Bond heads
11
Material types
8

Send us your die. We'll bond it.

Free sample bonding on the matching ENG machine. Share die, substrate and accuracy target, and an engineer replies within 24 hours.

Request sample bonding Request quote
  1. SendDie, substrate and target accuracy, under NDA if needed
  2. BondENG engineers run your parts on the matching machine
  3. ReportPlacement accuracy, process notes and a machine recommendation
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