Multi-Chip FC Module Integrated Bonder

A11

11-head all-in-one line bonder for high-power, multi-chip and FC module assembly

Bond heads: 11
Material types: 8
Vision systems: 9
DBC/hr: 120-150

ENG A11 Multi-Chip FC Module Integrated Bonder

What it does

A11 places up to eight material types in one machine, round or square solder preforms, FRD, IGBT and copper blocks, with matching automated feeders, 9 vision positioning sets and 9 spray positioning sets.

Suitable for

High-power, multi-chip and FC module lines
Round / square solder preforms
FRD, IGBT die and copper blocks

SiC sintering die attach Flip chip bonding

Highlights

Solder-preform and spray-positioning processes
Up to 8 materials per machine
Bottom spray system with up to 6 spray heads
Optional preform forming unit
Post-bond position accuracy check

A11 specifications

Manufacturer data, H1 2026. Throughput is under the stated standard conditions. Final values are confirmed in the technical agreement for your process.

Process compatibility	Solder preform process, spray positioning process
Materials	Up to 8 types
XY accuracy (local)	Die <5×5 mm: ≤±25 μm @3σ; die ≥5×5 mm: ≤±38 μm @3σ
Angle	≤±2° @3σ
Throughput	≥120-150 DBC/hr (each DBC ≥22 parts; depends on part count)
Die size	1-20 mm
Die thickness	≥70 μm
Track width	150-330 mm (height 960 ±30 mm)
Loading	Flexible vibratory feeder ×3, preform reel feeder ×3, magazine ×2
Bond force	20-50 g ±5 g / 50-300 g ±5%
Spray	Bottom spray, up to 6 heads
Preform forming	Optional
Footprint (excl. tower light)	3180 × 1900 × 2050 mm
Weight	≈4500 kg
Inspection	Ink-dot and defect recognition; post-bond position check
Safety	ESD protection, deionizer, light curtain