Copper Pin / Rivet Placement System
M18 Rivet
≥9,000 UPH copper-pin and pin-header placement from bulk feed
- UPH
- ≥9,000
- Nozzles
- 24
- XY @3σ
- ±50 μm
- Parts in hopper
- 500
What it does
Twin turret heads with 24 nozzles pick bulk parts from a flexible vibratory tray and place copper pins and shaped pin-headers for E-type modules. Dual tracks keep the line moving; the hopper alarms when it runs low.
Suitable for
- Copper pins (rivets) for E-type power modules
- Shaped pin-headers
Highlights
- Twin turret heads, 24 nozzles
- Fixed hopper + flexible vibratory tray (168 × 168 mm)
- Dual-track 3-section rail, 150-250 mm auto width
- Automatic fixture load/unload
- Low-material alarm
Rivet specifications
Manufacturer data, H1 2026. Throughput is under the stated standard conditions. Final values are confirmed in the technical agreement for your process.
| Max XY accuracy (local) | ±50 μm @3σ |
|---|---|
| Throughput | ≥9,000 pcs/hr |
| Materials | Copper pins, pin-headers |
| Track | Dual-track, 3-section, 150-250 mm, auto width |
| Flexible tray | 168 × 168 mm |
| Feeding | Fixed hopper + flexible vibratory tray; automatic fixture load/unload |
| Hopper | 500 parts, low-material alarm |
| Heads | Twin turret, 24 nozzles |
| Footprint | 1520 × 1700 × 2020 mm (excl. tower light, monitor) |
| Weight | 2200 kg |
| Inspection | Ink-dot recognition, die-defect similarity recognition |
| Safety | Deionizer, light curtain at operator window |
| Access control | Operator / engineer permission levels; wafer map read & generate (optional) |
Test your die on the M18 Rivet.
Send die and substrate samples or drawings. ENG engineers run a sample bonding and report placement accuracy and process results, free of charge.
- SendDie, substrate and target accuracy, under NDA if needed
- BondENG engineers run your parts on the matching machine
- ReportPlacement accuracy, process notes and a machine recommendation